Intel Corporation
Vertical backend transistor with ferroelectric material
Last updated:
Abstract:
Techniques and mechanisms to provide a memory array comprising a 1T1C (one transistor and one capacitor) based memory cell. In an embodiment, the memory cell comprises a transistor, fabricated on a backend of a die, and a capacitor which includes a ferroelectric material. The transistor of the 1T1C memory cell is a vertical transistor. In another embodiment, the capacitor is positioned vertically over the transistor.
Status:
Grant
Type:
Utility
Filling date:
29 Sep 2017
Issue date:
7 Jun 2022