Intel Corporation
Graphics processing integrated circuit package

Last updated:

Abstract:

An integrated circuit (IC) package apparatus is disclosed. The IC package includes one or more processing units and a bridge, mounted below the one or more processing unit, including one or more arithmetic logic units (ALUs) to perform atomic operations.

Status:
Grant
Type:

Utility

Filling date:

16 Jan 2020

Issue date:

14 Jun 2022