Intel Corporation
Graphics processing integrated circuit package
Last updated:
Abstract:
An integrated circuit (IC) package apparatus is disclosed. The IC package includes one or more processing units and a bridge, mounted below the one or more processing unit, including one or more arithmetic logic units (ALUs) to perform atomic operations.
Status:
Grant
Type:
Utility
Filling date:
16 Jan 2020
Issue date:
14 Jun 2022