Intel Corporation
FARADAY ROTATOR INTERCONNECT AS A THROUGH-VIA CONFIGURATION IN A PATCH ARCHITECTURE
Last updated:
Abstract:
Embodiments disclosed herein include optical systems with Faraday rotators in order to enhance efficiency. In an embodiment, a photonics package comprises an interposer and a patch over the interposer. In an embodiment, the patch overhangs an edge of the interposer. In an embodiment, the photonics package further comprises a photonics die on the patch and a Faraday rotator passing through a thickness of the patch. In an embodiment, the Faraday rotator is below the photonics die.
Status:
Application
Type:
Utility
Filling date:
15 Dec 2020
Issue date:
16 Jun 2022