Intel Corporation
FARADAY ROTATOR INTERCONNECT AS A THROUGH-VIA CONFIGURATION IN A PATCH ARCHITECTURE

Last updated:

Abstract:

Embodiments disclosed herein include optical systems with Faraday rotators in order to enhance efficiency. In an embodiment, a photonics package comprises an interposer and a patch over the interposer. In an embodiment, the patch overhangs an edge of the interposer. In an embodiment, the photonics package further comprises a photonics die on the patch and a Faraday rotator passing through a thickness of the patch. In an embodiment, the Faraday rotator is below the photonics die.

Status:
Application
Type:

Utility

Filling date:

15 Dec 2020

Issue date:

16 Jun 2022