Intel Corporation
FLEXIBLE VAPOR CHAMBER WITH SHAPE MEMORY MATERIAL
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Abstract:
Particular embodiments described herein provide for a flexible vapor chamber with shape memory material for an electronic device. In an example, the electronic device can include a flexible vapor chamber and shape memory material coupled to the shape memory material. When the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.
Status:
Application
Type:
Utility
Filling date:
23 Dec 2021
Issue date:
16 Jun 2022