Intel Corporation
FLEXIBLE VAPOR CHAMBER WITH SHAPE MEMORY MATERIAL

Last updated:

Abstract:

Particular embodiments described herein provide for a flexible vapor chamber with shape memory material for an electronic device. In an example, the electronic device can include a flexible vapor chamber and shape memory material coupled to the shape memory material. When the shape memory material is activated, the shape memory material moves a portion of the flexible vapor chamber to a position that helps with heat dissipation of heat collected by the flexible vapor chamber.

Status:
Application
Type:

Utility

Filling date:

23 Dec 2021

Issue date:

16 Jun 2022