Intel Corporation
Two-phase metallic alloys to facilitate thermal energy storage of a system on chip

Last updated:

Abstract:

Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.

Status:
Grant
Type:

Utility

Filling date:

28 Sep 2018

Issue date:

5 Jul 2022