Intel Corporation
Two-phase metallic alloys to facilitate thermal energy storage of a system on chip
Last updated:
Abstract:
Embodiments herein relate to systems, apparatuses, processing, and techniques related to patterning one or more sides of a thin film capacitor (TFC) sheet, where the TFC sheet has a first side and a second side opposite the first side. The first side and the second side of the TFC sheet are metal and are separated by a dielectric layer, and the patterned TFC sheet is to provide at least one of a capacitor or a routing feature on a first side of a substrate that has the first side and a second side opposite the first side.
Status:
Grant
Type:
Utility
Filling date:
28 Sep 2018
Issue date:
5 Jul 2022