Intel Corporation
Scalable debris-free socket loading mechanism

Last updated:

Abstract:

A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.

Status:
Grant
Type:

Utility

Filling date:

30 Mar 2018

Issue date:

12 Jul 2022