Intel Corporation
Scalable debris-free socket loading mechanism
Last updated:
Abstract:
A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.
Status:
Grant
Type:
Utility
Filling date:
30 Mar 2018
Issue date:
12 Jul 2022