Intel Corporation
Techniques for notebook hinge sensors

Last updated:

Abstract:

Techniques are described for notebook hinge sensors. For example, a computing device may comprise a housing having a processor circuit and an input device, the input device arranged on a side of the housing, a lid having a digital display arranged on a side of the lid, a hinge arranged to couple the housing and the lid, and a sensor module coupled to the processor circuit, the sensor module arranged inside the hinge and operative to capture motion input outside of the computing device.

Status:
Grant
Type:

Utility

Filling date:

1 Mar 2021

Issue date:

12 Jul 2022