Intel Corporation
Techniques for notebook hinge sensors
Last updated:
Abstract:
Techniques are described for notebook hinge sensors. For example, a computing device may comprise a housing having a processor circuit and an input device, the input device arranged on a side of the housing, a lid having a digital display arranged on a side of the lid, a hinge arranged to couple the housing and the lid, and a sensor module coupled to the processor circuit, the sensor module arranged inside the hinge and operative to capture motion input outside of the computing device.
Status:
Grant
Type:
Utility
Filling date:
1 Mar 2021
Issue date:
12 Jul 2022