Intel Corporation
High Density Skip Layer Transmission Line with Plated Slot

Abstract:

Methods and apparatus relating to a high density skip layer transmission line with a plated slot are described. In one embodiment, a printed circuit board includes a plurality of transmission lines. A first transmission from the plurality of transmission lines includes a first signal trace and a first ground plane and a first plated slot coupled to a second plated slot via the first ground plane. A ground shield is formed by the first plated slot, the second plated slot, the first ground plane, and a second ground plane. The ground shield surrounds the first signal trace to reduce crosstalk between signal traces. Other embodiments are also claimed and disclosed.