Intel Corporation
READILY ASSEMBLED/DISASSEMBLED COOLING ASSEMBLY FOR IMMERSION COOLED SEMICONDUCTOR CHIP PACKAGE

Abstract:

A cooling assembly is described. The cooling assembly includes a semiconductor chip package having input/outputs (I/Os) on a first surface and a package lid that is opposite the first surface, the semiconductor chip package has sides between the first surface and the package lid. The cooling assembly includes a structured element. The structured element has a structured surface to nucleate bubbles in a bath of coolant. The structured element has fixturing elements to secure the structured element to at least first and second ones of the sides of the semiconductor chip package. The structured element has a first thermal resistance. The cooling assembly has a thermal interface material between the package lid and the structured element. The thermal interface material has a second thermal resistance that is greater than the first thermal resistance and within an order of magnitude of the first thermal resistance.