Intel Corporation
TECHNOLOGIES FOR TERMINATION FOR MICRORING MODULATORS

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Abstract:

Techniques for termination for microring modulators are disclosed. In the illustrative embodiment, a microring modulator on a photonic integrated circuit (PIC) die is modulated by radiofrequency (RF) signals connected to electrodes across the microring modulator. A resistor is connected to each of the electrodes. The resistors both provide termination for the RF signals, preventing or reducing reflections, as well as forming part of a bias tee, allowing for a DC bias voltage to be applied across the electrodes.

Status:
Application
Type:

Utility

Filling date:

1 Apr 2022

Issue date:

14 Jul 2022