Intel Corporation
MICROELECTRONIC DEVICES DESIGNED WITH COMPOUND SEMICONDUCTOR DEVICES AND INTEGRATED ON AN INTER DIE FABRIC

Abstract:

Embodiments of the invention include a microelectronic device that includes a first silicon based substrate having compound semiconductor components. The microelectronic device also includes a second substrate coupled to the first substrate. The second substrate includes an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.