Intel Corporation
SUBSTRATE EMBEDDED MAGNETIC CORE INDUCTORS AND METHOD OF MAKING
Last updated:
Abstract:
Described are microelectronic devices including an embedded microelectronic package for use as an integrated voltage regulator with a microelectronic system. The microelectronic package can include a substrate and a magnetic foil. The substrate can define at least one layer having one or more of electrically conductive elements separated by a dielectric material. The magnetic foil can have ferromagnetic alloy ribbons and can be embedded within the substrate adjacent to the one or more of electrically conductive elements. The magnetic foil can be positioned to interface with and be spaced from the one or more of electrically conductive element.
Status:
Application
Type:
Utility
Filling date:
28 Apr 2022
Issue date:
11 Aug 2022