Intel Corporation
Multi-purpose interface for configuration data and user fabric data

Last updated:

Abstract:

An integrated circuit device may include a programmable fabric die having programmable logic fabric and configuration memory that may configure the programmable logic fabric. The integrated circuit device may also include a base die that may provide fabric support circuitry, including memory and/or communication interfaces. The first die and the second die may be coupled using a multi-purpose interface that may allow communication between the first die and the second die. The multi-purpose interface may allow concurrent access to the base die by the programmable logic fabric and the configuration memory by using multiple channels over the multi-purpose interface.

Status:
Grant
Type:

Utility

Filling date:

10 Nov 2020

Issue date:

23 Aug 2022