Intel Corporation
Scalable, high load, low stiffness, and small footprint loading mechanism

Last updated:

Abstract:

A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.

Status:
Grant
Type:

Utility

Filling date:

30 Mar 2018

Issue date:

20 Sep 2022