Intel Corporation
Electrical testing apparatus with lateral movement of a probe support substrate

Abstract:

An electrical-test apparatus is provided, which includes a plurality of tester interconnect structures cantilevered from a first side of a substrate. A base may be coupled to a second side of the substrate via one or more interconnect layers. The tester interconnect structures may contact corresponding interconnect structures of a device under test (DUT). In an example, the substrate is laterally movable relative to the DUT along a plane of the substrate, upon contact between the tester interconnect structures and the interconnect structures of the DUT.