Intel Corporation
Techniques in performance and efficiency improvements of processors in a cooling system
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Abstract:
Embodiments of the present disclosure describe methods, apparatuses, storage media, and systems for Thermal Design Power (TDP) rebalancing among thermally-coupled processors and non-thermally-coupled processors, providing computing efficiency or homogeneity with respect to, including but not limited to, thermal requirements, power consumption, and processor operations. The TDP rebalancing may include implementing management circuitry and configuration control circuitry. Other embodiments may be described and claimed.
Status:
Grant
Type:
Utility
Filling date:
28 Jun 2019
Issue date:
13 Jul 2021