Intel Corporation
Architectural enhancements for computing systems having artificial intelligence logic disposed locally to memory

Last updated:

Abstract:

A semiconductor chip is described. The semiconductor chip includes memory address decoder logic circuitry comprising different memory address bit manipulation paths to respectively impose different memory interleaving schemes for memory accesses directed to artificial intelligence information in a memory and non artificial intelligence information in the memory. The artificial intelligence information is to be processed with artificial intelligence logic circuitry disposed locally to the memory.

Status:
Grant
Type:

Utility

Filling date:

26 Apr 2019

Issue date:

15 Jun 2021