Intel Corporation
Processor package with optimization based on package connection type
Last updated:
Abstract:
The systems and methods disclosed herein provide an improved processor package to determine a connection type between the package and an external circuit and to optimize processor performance based on the connection type. As a non-limiting example, a processor package consistent with the present disclosure may include a central processing unit (CPU) die and a plurality of pins (including two connection detection pins) to connect the package to a motherboard. The CPU die may include connection determination logic and execution policy logic, implemented via processor code ("p-code"), as well as a more typical processor.
Status:
Grant
Type:
Utility
Filling date:
29 Jun 2018
Issue date:
1 Jun 2021