Intel Corporation
Three-dimensional nanoribbon-based logic
Last updated:
Abstract:
Described herein are three-dimensional nanoribbon-based logic ICs that include one of more of 1) individual gate control in a vertical stack of nanoribbons, 2) inter-ribbon interconnects in a vertical stack of nanoribbons, and 3) both P- and N-type nanoribbons in a vertical stack of nanoribbons. Using one or more of these features may help realize unique monolithic 3D logic architectures that were not possible with conventional logic circuits and may allow realizing logic devices with favorable metrics in terms of power and performance while preserving the substrate area and cost.
Status:
Grant
Type:
Utility
Filling date:
16 Dec 2019
Issue date:
25 May 2021