Intel Corporation
TECHNOLOGIES FOR POWER TUNNELS ON CIRCUIT BOARDS

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Abstract:

Techniques for power tunnels on circuit boards are disclosed. A power tunnel may be created in a circuit board by drilling through non-conductive layers to a conductive trace and then filling in the hole with a conductor. A power tunnel can have a high cross-sectional area and can carry a larger amount of current than an equivalent-width trace, reducing the area on a circuit board required to carry that amount of current.

Status:
Application
Type:

Utility

Filling date:

25 Mar 2021

Issue date:

8 Jul 2021