Intel Corporation
HIGH VOLTAGE ULTRA-LOW POWER THICK GATE NANORIBBON TRANSISTORS FOR SOC APPLICATIONS
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Abstract:
Embodiments disclosed herein include nanoribbon and nanowire semiconductor devices. In an embodiment, the semiconductor device comprises a nanowire disposed above a substrate. In an embodiment, the nanowire has a first dopant concentration, and the nanowire comprises a pair of tip regions on opposite ends of the nanowire. In an embodiment, the tip regions comprise a second dopant concentration that is greater than the first dopant concentration. In an embodiment, the semiconductor device further comprises a gate structure over the nanowire. In an embodiment, the gate structure is wrapped around the nanowire, and the gate structure defines a channel region of the device. In an embodiment, a pair of source/drain regions are on opposite sides of the gate structure, and both source/drain regions contact the nanowire.
Utility
13 Dec 2019
17 Jun 2021