Intel Corporation
BATHTUB INTEGRATED HEAT SPREADER WITH MULTIPLE THERMAL-INTERFACE MATERIAL FOR INTEGRATED-CIRCUIT PACKAGES

Abstract:

Disclosed embodiments include multiple thermal-interface material at the interface between an integrated heat spreader and a heat sink. A primary thermal-interface material has flow qualities and a secondary thermal-interface material has containment and adhesive qualities. The integrated heat spreader has a basin form factor that contains the primary thermal-interface material.