Intel Corporation
IMPROVED MEMORY MODULE THAT CONSERVES MOTHERBOARD WIRING SPACE
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Abstract:
An apparatus is described. The apparatus includes a module to plug-into a printed circuit board. The module has a connector along a center axis of the module. The module further has a first semiconductor chip disposed in a first region of the module that resides between an edge of the module and a side of the connector. The module has a second semiconductor chip disposed in a second region of the module that resides between an opposite edge of the module and an opposite side of the connector.
Status:
Application
Type:
Utility
Filling date:
23 Dec 2020
Issue date:
17 Jun 2021