Intel Corporation
MAGNETIC MEMORY DEVICES AND METHODS OF FABRICATION
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Abstract:
A memory device includes a first electrode, a second electrode and a magnetic tunnel junction (MTJ) between the first electrode and the second electrode. The MTJ includes a fixed magnet, a free magnet and a tunnel barrier between the fixed magnet and the free magnet. The MTJ further includes a conductive layer between the free magnet and the second electrode, the conductive layer having a metallic dopant, where the metallic dopant has a concentration that increase with distance from an interface between the free magnet and the conductive layer. A capping layer is between the conductive layer and the second electrode.
Status:
Application
Type:
Utility
Filling date:
6 Dec 2019
Issue date:
10 Jun 2021