Intevac, Inc.
Patterned chuck for substrate processing
Last updated:
Abstract:
A chuck for wafer processing that counters the deleterious effects of thermal expansion of the wafer. Also, a combination of chuck and shadow mask arrangement that maintains relative alignment between openings in the mask and the wafer in spite of thermal expansion of the wafer. A method for fabricating a solar cell by ion implant, while maintaining relative alignment of the implanted features during thermal expansion of the wafer.
Status:
Grant
Type:
Utility
Filling date:
19 Jan 2017
Issue date:
15 Oct 2019