Intevac, Inc.
Patterned chuck for substrate processing

Last updated:

Abstract:

A chuck for wafer processing that counters the deleterious effects of thermal expansion of the wafer. Also, a combination of chuck and shadow mask arrangement that maintains relative alignment between openings in the mask and the wafer in spite of thermal expansion of the wafer. A method for fabricating a solar cell by ion implant, while maintaining relative alignment of the implanted features during thermal expansion of the wafer.

Status:
Grant
Type:

Utility

Filling date:

19 Jan 2017

Issue date:

15 Oct 2019