Intevac, Inc.
CREATION OF DISTRIBUTED VOIDS IN THIN FILMS
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Abstract:
A method for forming thin film layer having micro-voids therein. The method proceeds by dispersing micro-particles over the surface of a substrate. The micro particles are made of sublimable material. Then the thin film layer is formed over the surface, so as to cover the particles. The thin film is then etched back so as to expose the particles at least partially. The material of the particles is then sublimed, e.g., by heating the substrate, thereby leaving micro-voids inside the thin film layer. The micro voids can be filled or remain exposed to generate textured surface.
Status:
Application
Type:
Utility
Filling date:
3 May 2021
Issue date:
18 Nov 2021