Juniper Networks, Inc.
Apparatus, system, and method for retaining thermal interface material between electrical components and heatsinks
Last updated:
Abstract:
The disclosed interference-fit frame includes (1) a border dimensioned for installation around an electrical component coupled to a circuit board, wherein (A) the border forms an opening in which the electrical component resides when the border is installed and (B) at least a portion of the border constitutes a retention dam that rises beyond the electrical component when the border is installed, and (2) at least one protuberance that extends from the border into the opening. Various other apparatuses, systems, and methods are also disclosed.
Status:
Grant
Type:
Utility
Filling date:
19 Mar 2020
Issue date:
18 Jan 2022