Juniper Networks, Inc.
DIE-TO-WAFER BONDING UTILIZING MICRO-TRANSFER PRINTING

Abstract:

Described herein is a die-to-wafer bonding process that utilizes micro-transfer printing to transfer die from a source wafer onto an intermediate handle wafer. The resulting intermediate handle wafer structure can then be bonded die-down onto the target wafer, followed by removal of only the intermediate handle wafer, leaving the die in place bonded to the target wafer.