Juniper Networks, Inc.
STRUCTURE FOR CIRCUIT INTERCONNECTS

Last updated:

Abstract:

Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.

Status:
Application
Type:

Utility

Filling date:

5 Apr 2021

Issue date:

22 Jul 2021