Juniper Networks, Inc.
STRUCTURE FOR CIRCUIT INTERCONNECTS
Last updated:
Abstract:
Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.
Status:
Application
Type:
Utility
Filling date:
5 Apr 2021
Issue date:
22 Jul 2021