Juniper Networks, Inc.
Structure for circuit interconnects

Last updated:

Abstract:

Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.

Status:
Grant
Type:

Utility

Filling date:

26 Apr 2018

Issue date:

4 May 2021