Juniper Networks, Inc.
Structure for circuit interconnects
Last updated:
Abstract:
Described are various configurations of high-speed via structures. Various embodiments can reduce or entirely eliminate insertion loss in high-speed signal processing environments by using impedance compensation structures that decrease a mismatch in components of a circuit. An impedance compensation structure can include a metallic structure placed near a via to lower an impedance difference between the via and a conductive pathway connected to the via.
Status:
Grant
Type:
Utility
Filling date:
26 Apr 2018
Issue date:
4 May 2021