Littelfuse, Inc.
HOTSPOT THERMAL MANAGEMENT OF POWER ELECTRONIC PACKAGE WITH NANO DIE ATTACH MATERIAL

Abstract:

Embodiments herein are directed to semiconductor package assemblies and methods of forming. In some embodiments, a semiconductor package assembly includes a substrate, a first metallization layer disposed adjacent the substrate, and a semiconductor die disposed in thermal contact with the first metallization layer. The semiconductor package assembly may further include a die attach layer disposed between the semiconductor die and the first metallization layer, the die attach layer including a polymer matrix and a nano-metal particle filler.