Littelfuse, Inc.
Power semiconductor device having guard ring structure, and method of formation
Last updated:
Abstract:
In one embodiment, a power semiconductor device may include a semiconductor substrate, wherein the semiconductor substrate comprises an active device region and a junction termination region. The power semiconductor device may also include a polysilicon layer, disposed over the semiconductor substrate. The polysilicon layer may include an active device portion, disposed over the active device region, and defining at least one semiconductor device; and a junction termination portion, disposed over the junction termination region, the junction termination portion defining a ring structure.
Status:
Grant
Type:
Utility
Filling date:
6 Mar 2019
Issue date:
20 Apr 2021