Littelfuse, Inc.
Power semiconductor device having guard ring structure, and method of formation

Last updated:

Abstract:

In one embodiment, a power semiconductor device may include a semiconductor substrate, wherein the semiconductor substrate comprises an active device region and a junction termination region. The power semiconductor device may also include a polysilicon layer, disposed over the semiconductor substrate. The polysilicon layer may include an active device portion, disposed over the active device region, and defining at least one semiconductor device; and a junction termination portion, disposed over the junction termination region, the junction termination portion defining a ring structure.

Status:
Grant
Type:

Utility

Filling date:

6 Mar 2019

Issue date:

20 Apr 2021