LG Display Co., Ltd.
Integrated circuit package and display device using the same

Abstract:

An integrated circuit package and a display device using the same are discussed. The bottom surface of the integrated circuit package includes a first barrier bump area in which a plurality of barrier bumps is arranged, configured to be disposed between an input bump area and an output bump area; and a second barrier bump area in which a plurality of barrier bumps is arranged, configured to be disposed between the first barrier bump area and the output bump area. The first barrier bump area is closer to the input bump area than the second barrier bump area, and the second barrier bump area is closer to the output bump area than the first barrier bump area.