Meta Platforms, Inc.
Thermal mass aware thermal management

Last updated:

Abstract:

The disclosed computing device may include electronic components, at least one of which is a processor. The computing device may also include a heat sink thermally coupled to the electronic components, as well as a temperature sensor that determines the current temperature inside the computing device. The computing device may further include a controller. The processor may generate a load schedule for the electronic components based on the current temperature inside the computing device. This load schedule ensures that a maximum temperature for the heat sink is not exceeded even when the total system power load exceeds, for a short period of time, the maximum sustainable power level the heat sink can dissipate. The controller may then load the electronic components according to the generated load schedule. Various other methods, systems, and computer-readable media are also disclosed.

Status:
Grant
Type:

Utility

Filling date:

28 Aug 2018

Issue date:

24 Nov 2020