Magna International Inc.
POWER CONVERTER WITH INTEGRATED MULTI-LAYER COOLING

Abstract:

A power converter includes an integrated multi-layer cooling structure. The power converter includes a plurality of printed circuit boards (PCBs) stacked together in a generally vertical arrangement. A liquid cooling mechanism is attached to a lower-most PCB, and high loss circuitry components are attached to an opposite side of the lower-most PCB. Low loss circuitry components are attached to further PCBs. Magnetic components may be attached to the further PCBs. The high loss components are actively cooled by the liquid cooling mechanism and the low loss components and magnetic components are passively cooled. The liquid cooling mechanism may be a cold plate heatsink. The power converter may include intermediate PCBs disposed between the upper-most PCB and the lower-most PCB, with low loss circuitry components attached to the intermediate PCBs.