Monolithic Power Systems, Inc.
MULTI-DIE PACKAGE STRUCTURE AND MULTI-DIE CO-PACKING METHOD
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Abstract:
A multi-die package structure with an embedded die embedded in a substrate, and a flip chip die mounted above the substrate is discussed. The package is compact and low cost.
Status:
Application
Type:
Utility
Filling date:
21 Jan 2021
Issue date:
21 Jul 2022