Monolithic Power Systems, Inc.
MULTI-DIE PACKAGE STRUCTURE AND MULTI-DIE CO-PACKING METHOD

Last updated:

Abstract:

A multi-die package structure with an embedded die embedded in a substrate, and a flip chip die mounted above the substrate is discussed. The package is compact and low cost.

Status:
Application
Type:

Utility

Filling date:

21 Jan 2021

Issue date:

21 Jul 2022