Everspin Technologies, Inc.
Magnetoresistive devices and methods of fabricating such devices
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Abstract:
An integrated circuit (IC) device includes a logic portion including logic circuits in multiple vertically stacked metal layers interconnected by one or more via layers, and a memory portion with a plurality of magnetoresistive devices. Each magnetoresistive device is provided in a single metal layer of the multiple vertically stacked metal layers of the IC device.
Status:
Grant
Type:
Utility
Filling date:
17 Sep 2019
Issue date:
28 Dec 2021