Everspin Technologies, Inc.
Magnetoresistive devices and methods of fabricating such devices

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Abstract:

An integrated circuit (IC) device includes a logic portion including logic circuits in multiple vertically stacked metal layers interconnected by one or more via layers, and a memory portion with a plurality of magnetoresistive devices. Each magnetoresistive device is provided in a single metal layer of the multiple vertically stacked metal layers of the IC device.

Status:
Grant
Type:

Utility

Filling date:

17 Sep 2019

Issue date:

28 Dec 2021