Everspin Technologies, Inc.
Apparatus and methods for integrating magnetoresistive devices
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Abstract:
An integrated circuit device includes a memory portion and a logic portion. The memory portion may include a plurality of magnetoresistive devices and the logic portion may include logic circuits. The memory portion may include a plurality of metal conductors separated by a first interlayer dielectric material (ILD), wherein the first ILD is a low-k ILD or an ultra low-k ILD. And, the logic portion may include a plurality of metal conductors separated by a second interlayer dielectric material (ILD).
Status:
Grant
Type:
Utility
Filling date:
8 Nov 2018
Issue date:
16 Mar 2021