Everspin Technologies, Inc.
Apparatus and methods for integrating magnetoresistive devices

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Abstract:

An integrated circuit device includes a memory portion and a logic portion. The memory portion may include a plurality of magnetoresistive devices and the logic portion may include logic circuits. The memory portion may include a plurality of metal conductors separated by a first interlayer dielectric material (ILD), wherein the first ILD is a low-k ILD or an ultra low-k ILD. And, the logic portion may include a plurality of metal conductors separated by a second interlayer dielectric material (ILD).

Status:
Grant
Type:

Utility

Filling date:

8 Nov 2018

Issue date:

16 Mar 2021