Everspin Technologies, Inc.
Methods of manufacturing integrated circuits using isotropic and anisotropic etching processes
Last updated:
Abstract:
A method of fabricating a magnetoresistive device includes etching a magnetoresistive stack using a first etching process to form one or more sidewalls, and etching the stack using a second etching process after forming the one or more sidewalls. Wherein, the second etching process may be relatively more isotropic than the first etching process.
Status:
Grant
Type:
Utility
Filling date:
28 Nov 2018
Issue date:
24 Nov 2020