Everspin Technologies, Inc.
Methods of manufacturing integrated circuits using isotropic and anisotropic etching processes

Last updated:

Abstract:

A method of fabricating a magnetoresistive device includes etching a magnetoresistive stack using a first etching process to form one or more sidewalls, and etching the stack using a second etching process after forming the one or more sidewalls. Wherein, the second etching process may be relatively more isotropic than the first etching process.

Status:
Grant
Type:

Utility

Filling date:

28 Nov 2018

Issue date:

24 Nov 2020