Materion Corporation
Ceramic combo lid with selective and edge metallizations

Last updated:

Abstract:

A frame lid for use with a semiconductor package is disclosed. First, a mask is applied to a top surface of the lid and over a central area of the top surface to define a peripheral area. Next, a seal ring is formed by metallizing the peripheral area and the sidewall of the plate. The mask can then be removed obtain the frame lid. Next, a solder preform can be attached to the seal ring. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.

Status:
Grant
Type:

Utility

Filling date:

28 Apr 2017

Issue date:

29 Jun 2021