Materion Corporation
Ceramic combo lid with selective and edge metallizations
Last updated:
Abstract:
A frame lid for use with a semiconductor package is disclosed. First, a mask is applied to a top surface of the lid and over a central area of the top surface to define a peripheral area. Next, a seal ring is formed by metallizing the peripheral area and the sidewall of the plate. The mask can then be removed obtain the frame lid. Next, a solder preform can be attached to the seal ring. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.
Status:
Grant
Type:
Utility
Filling date:
28 Apr 2017
Issue date:
29 Jun 2021