Materion Corporation
Cover lid with selective and edge metallization

Last updated:

Abstract:

A cover lid for use with a semiconductor package is disclosed. First, a polyamide mask is applied to one surface of the lid plate. Next, the exposed areas of the surface, as well as the sides of the lid plate, are metallized. The polyamide mask can then be removed. This reduces pullback and shrinkage of the metallized layer, while lowering the manufacturing cost and process times.

Status:
Grant
Type:

Utility

Filling date:

21 May 2015

Issue date:

8 Jun 2021