MACOM Technology Solutions Holdings, Inc.
UNIBODY LATERAL VIA

Abstract:

Semiconductor devices are described. In one example, the semiconductor device includes a substrate, a layer of first semiconductor material over the substrate, a layer of second semiconductor material over the layer of first semiconductor material, a first metal contact formed on the layer of first semiconductor material, a second metal contact formed on the layer of second semiconductor material, and a metal via that extends from a backside of the substrate, through the substrate, through the layer of first semiconductor material, and contacts a bottom surface of the first metal contact. In this configuration, a direct electrical connection can be achieved between the backside of the substrate and the metal contact on the layer of first semiconductor material without the need for an additional metal connection, such as a metal air bridge, to the metal contact.