Micron Technology, Inc.
INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS

Abstract:

An interconnect structure for a semiconductor device is provided herein. The interconnect structure generally includes a conductive pillar electrically coupled to a conductive contact positioned on a semiconductor die and a trace receiver on a distal end of the pillar. The trace receiver has a body electrically coupled to the distal end, and may include a first leg projecting from a first side of the body away from the distal end and a second leg projecting from a second side of the body away from the distal end, such that the body, the first leg, and the second leg together form a cavity. During assembly of the semiconductor device, the cavity is configured to at least partially surround a portion of a semiconductor trace positioned in an insulated substrate. To form the electrical connection, a solder material may be disposed between the trace receiver and the trace.