Micron Technology, Inc.
MULTICHIP MEMORY PACKAGE WITH INTERNAL CHANNEL

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Abstract:

Methods, systems, and devices for multichip memory packages are described. A multichip memory package may include at least two dies that include different types of memory, such as one die that includes non-volatile memory and another die that includes volatile memory. The package may include an in-package channel that supports internal data transfer between the two types of memory. For example, a respective controller for each of the types of memory may also be included in the package and may be coupled with each other via the in-package interface. In some cases, data may be read from one of the types of memory and written to the other type of memory in response to a single read or write command and without passing over any interface outside of the package.

Status:
Application
Type:

Utility

Filling date:

29 Jan 2020

Issue date:

29 Jul 2021