Micron Technology, Inc.
Apparatuses and related methods for staggering power-up of a stack of semiconductor dies

Last updated:

Abstract:

An apparatus including semiconductor dies in a stack. The semiconductor dies are configured to power-up in a staggered manner. Methods for powering up an electronic device include detecting a power-up event with the semiconductor dies in the stack, and responsive to the power-up event, powering up a first semiconductor die in the stack at a first time, and powering up a second semiconductor die in the stack at a second time that is different from the first time.

Status:
Grant
Type:

Utility

Filling date:

22 Aug 2018

Issue date:

17 Aug 2021