Micron Technology, Inc.
Apparatuses and related methods for staggering power-up of a stack of semiconductor dies
Last updated:
Abstract:
An apparatus including semiconductor dies in a stack. The semiconductor dies are configured to power-up in a staggered manner. Methods for powering up an electronic device include detecting a power-up event with the semiconductor dies in the stack, and responsive to the power-up event, powering up a first semiconductor die in the stack at a first time, and powering up a second semiconductor die in the stack at a second time that is different from the first time.
Status:
Grant
Type:
Utility
Filling date:
22 Aug 2018
Issue date:
17 Aug 2021