Micron Technology, Inc.
Apparatuses and methods for repairing memory devices including a plurality of memory die and an interface

Abstract:

Apparatuses and methods for repairing memory devices including a plurality of memory die and an interface are disclosed. An example apparatus includes a first stack that includes a plurality of first dies stacked with one another, the first dies include a plurality of first channels, at least one of which is designated as a first defective channel, and further includes a second stack stacked with the first stack and including a plurality of second dies stacked with one another, the second dies including a plurality of second channels, at least one of which is designated as a second defective channel. A control circuit is configured, responsive to a command for accessing the first defective channel, to access one of the plurality of second channels in place of accessing the first defective channel, wherein the one of the plurality of second channels corresponds to the first defective channel and is not designated as the second defective channel.