Micron Technology, Inc.
Memory Arrays And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells And Operative Through-Array-Vias
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Abstract:
A method used in forming a memory array comprising strings of memory cells and operative through-array-vias (TAVs) comprises forming a stack comprising vertically-alternating insulative tiers and conductive tiers. The stack comprises a TAV region and an operative memory-cell-string region. Operative channel-material strings are formed in the stack in the operative memory-cell-string region and dummy channel-material strings are formed in the stack in the TAV region. At least a majority of channel material of the dummy channel-material strings is replaced in the TAN region with insulator material and operative TAVs are formed in the TAV region. Other methods and structures independent of method are disclosed.
Utility
13 May 2021
30 Sep 2021