Micron Technology, Inc.
APPARATUSES AND METHODS FOR DIFFERENT IO WIDTHS FOR STACKED DIE

Abstract:

Apparatuses and methods for providing data from stacked memory are described. The stacked memory may include multiple die. In some examples, a master die may receive data from one or more slave die. The master die may provide data from the master die and the data from the one or more slave die to a plurality of output terminals. Different ones of the output terminals may provide data from a different die of the stacked memory. In some examples, the data may be retrieved from the multiple die concurrently.