Micron Technology, Inc.
APPARATUSES AND METHODS FOR DIE REPLACEMENT IN STACKED MEMORY

Abstract:

Apparatuses and methods for repairing a memory are disclosed. In some examples, the memory may be a stacked memory that includes multiple die and at least one spare die. In some examples, a die may determine it is defective and provide signals causing the defective die to be disabled and a spare die to be enabled. In some examples, a component external to the memory, such as a memory controller, may determine a die is defective and provide signals causing the defective die to be disabled and a spare die to be enabled. In some examples, die may be enabled or disabled by fuses/antifuses.