Micron Technology, Inc.
Electrode/dielectric barrier material formation and structures
Last updated:
Abstract:
Methods, apparatuses, and systems related to forming a barrier material between an electrode and a dielectric material are described. An example method includes forming a dielectric material on a bottom electrode material of a storage node in a semiconductor fabrication process. The method further includes forming a barrier material on the dielectric material to reduce oxygen vacancies in the dielectric material. The method further includes forming a top electrode on the barrier material.
Status:
Grant
Type:
Utility
Filling date:
26 Jun 2020
Issue date:
12 Oct 2021