Micron Technology, Inc.
Electrode/dielectric barrier material formation and structures

Last updated:

Abstract:

Methods, apparatuses, and systems related to forming a barrier material between an electrode and a dielectric material are described. An example method includes forming a dielectric material on a bottom electrode material of a storage node in a semiconductor fabrication process. The method further includes forming a barrier material on the dielectric material to reduce oxygen vacancies in the dielectric material. The method further includes forming a top electrode on the barrier material.

Status:
Grant
Type:

Utility

Filling date:

26 Jun 2020

Issue date:

12 Oct 2021